Wafer level Nanoimprint Master
Wafer level templates are one of the most commonly used templates, and the processing method is also the most common processing method based on photolithography and etching.Because typical contact exposure, laser direct writing, and electron beam lithography are based on wafers, they are collectively referred to as wafer-level templates.Its application is also the most extensive, such as the current hot micro-nano optics (including DOE, TOF and AR/VR, etc.), physical and chemical basic research, anti-counterfeiting identification, biochip and other fields.
This type of template is usually processed by rotating photoresist onto the wafer and using conventional lithography methods to obtain a photoresist eye plate, and subsequent dry etching process to protect a specific area to form a certain depth to obtain a specific pattern shape.See Wafer Level Template Processing for more details.
- Micro/Nano structure Simple fabrication
- The structural characteristics range from tens of nanometers to hundreds of microns
- X-Y dimensional accuracy is <±10%, Y direction dimensional accuracy is <15%
- Effective area can be up to 4 “or 6” wafer size
- The surface structure is mostly 2D
- Usually, the aspect ratio of the characteristic structure is about <2:1, and the larger aspect ratio requires special technology
- Through hole processing is not acceptable
- Accept custom structure
- Common wafer materials are silicon or fused quartz